Method for positioning a semiconductor die within a temporary package
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United States of America Patent
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-
Mar 5, 2002
Issued Date -
N/A
app pub date -
Jan 20, 1999
filing date -
Apr 18, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for positioning a semiconductor die within a temporary package, including forming a representation of at least a portion of a semiconductor die, moving the semiconductor die to a location proximate a temporary package, and comparing the representation of the at least a portion of the semiconductor die to a representation of at least a portion of the temporary package. The compared representations are then used to define movement of a die moving assembly, in order to move the die to place the semiconductor die and the temporary package into a desired relationship to one another. A restraining device is then secured to the temporary package to retain the semiconductor die in the desired relationship to the temporary package.
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