Method of making mechanical-laser structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 12, 2002
Grant Date -
N/A
app pub date -
May 6, 1999
filing date -
Mar 9, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A mechanical-laser structure on a printed circuit board and a carrier. A method for fabricating the mechanical-laser structure includes the following steps. A substrate is provided. A first through hole is formed in the substrate by mechanical drilling. An epoxy plug is formed within the first through hole. A conductive layer is formed on the substrate by compression. The conductive layer is patterned to form conducting wires and exposes the epoxy plug. A micro via is formed within the epoxy plug by laser drilling.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully