Thermally enhanced packaged semiconductor assemblies
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United States of America Patent
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-
Mar 12, 2002
Issued Date -
N/A
app pub date -
Aug 30, 1999
filing date -
Oct 24, 1996
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding contacts overlying the front face of the chip. The flange bonding contacts are coplanar with the chip bonding contacts, or can be brought into coplanar alignment by flexure of the cap. The package can be surface-mounted to a circuit board by placing the package onto pads of solder paste, and then heating the assembly to melt the solder paste in order to join the bonding contacts on the chip and on the flange to corresponding contacts on the circuit board.
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