Polishing composition
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United States of America Patent
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Mar 12, 2002
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N/A
app pub date -
Feb 11, 2000
filing date -
Feb 11, 2000
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Abstract
A polishing composition comprising an abrasive, an anticorrosive, an oxidizing agent, an acid, a pH regulator and water and having a pH within a range of from 2 to 5, wherein the abrasive is colloidal silica or fumed silica, and its primary particle size is at most 20 nm.
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