Importance

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Abstract

A carrier tape system for receiving, retaining and quickly releasing small components, such as singulated bare die or integrated circuit (IC) chips for automated assembly processing. The carrier tape system is comprised of a longitudinally elongated flexible carrier tape frame with a plurality of spaced apart aperture cavities and a pair of pressure sensitive adhesive tape rails affixed to one surface of the carrier tape frame with the adhesive surfaces facing into the aperture cavities of the carrier tape frame. Each PSA tape rail has a longitudinal linear side edge and a configured side edge, where the linear side edge is affixed to the surface of the of the carrier tape frame and the configured side edge extends into and overlaps the aperture cavities for adhesioning the back side of the small components. With the configured side edges of PSA tape rails, a range or adhesion levels can be achieved with the PSA tape rails in one fixed gap width location. The configured side edges of the PSA tape rails minimize adhesive contact with the back sides of the small components contained within the aperture cavities of the carrier tape frame, and thereby quickly release the small components from the aperture cavities.

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First Claim