Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 19, 2002
Issued Date -
N/A
app pub date -
Jan 15, 1999
filing date -
May 2, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The semiconductor package including a semiconductor element 11 having a first face 21a and a second face 21b which is opposite to the first face 21a, an electrode 22 provided on the first face 21a, and a conductive lead 23 connected to the electrode 22 comprises an insulating film member 24 provided on the second face 21b for connecting the other end of the lead, the lead 23 is bent as oppose to a side face of the semiconductor element 11, and is connected each other with an elastic force between the electrode 22 and the film member 24, a bent part of the lead between the electrode 22 and the film member 24 turns to be a terminal part 23a. The circuit board has a connection means, connecting to the terminal unit 23a, and having an adequate size for placing the semiconductor package 11. The connection means is constituted of an accommodation groove part 46 or a frame part 50, and a plurality of pattern electrodes 47a, 47b, and the terminal part 23a is connected between the pattern electrodes 47a, 47b.
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