Mounting component with leads having polymeric strips
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United States of America Patent
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-
Mar 19, 2002
Issued Date -
N/A
app pub date -
Aug 13, 1996
filing date -
Jul 24, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip mounting component includes a support structure having top and bottom surfaces and an edge, a plurality of electrically conductive leads, not attached to a chip, each lead having a first end securement section secured to the support structure and having a connection section integral with the first end securement section projecting beyond the edge of the support structure, and a flexible polymeric reinforcement in contact with and extending along the connection section of each lead, each polymeric reinforcement being separate from the polymeric reinforcements in contact with the other leads, each polymeric reinforcement extending beyond the edge of the support structure wherein each connection section is flexible and may be individually displaced without displacement of connection sections of adjacent ones of the leads.
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