Method for marking packaged integrated circuits
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United States of America Patent
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Mar 19, 2002
Grant Date -
N/A
app pub date -
Aug 2, 1999
filing date -
Aug 2, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
The invention provides methods for marking packaged ICs. In a first embodiment, only the minimum performance information is first marked on the package, regardless of the actual performance of the IC. This method avoids a second marking step for all ICs sold as low-performance ICs. In another embodiment, only one inking and curing step is required for all ICs. According to this method, all specified performances are marked on the packaged IC at the first marking. The IC is then tested to determine the actual performance, and all performance markings not applicable to the IC are removed, preferably with a laser. Alternatively, all applicable performance markings are identified (e.g., underlined or enclosed with a laser marking).
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