Thermal cycling module
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United States of America Patent
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Mar 19, 2002
Grant Date -
N/A
app pub date -
Mar 11, 1998
filing date -
Mar 11, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thermal cycling module for thermally processing a substrate has a thermally-conductive support structure with a planar first side and a second side with a plurality of recesses. A heater is disposed on the first side of the support structure and a fluid distributor positioned beneath the second side of the support structure to direct a coolant onto the support structure to decrease the temperature of the substrate. The fluid distributor may have a plurality of rotatable arms and a plurality of nozzles attached to each arm.
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