Wafer-pair having deposited layer sealed chambers
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United States of America Patent
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Mar 19, 2002
Grant Date -
N/A
app pub date -
Mar 31, 1998
filing date -
Mar 31, 1998
priority date (Note) -
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Abstract
A wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, and may be divided into chips.
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