Apparatus and method for assessing solderability

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6360935
SERIAL NO

09237774

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention is an apparatus and method for assessing the solderability of electronic component leads and adjacent mounting surfaces. The apparatus and method enables assessment of solderability of fine pitch surface mount components that may be 'leadless' or have such small leads that other methods are unable to make measurements required for assessing solderability. The invention also provides a reliable automated test technology for electronic component solderability. It is based on the use of measurements of the distinctive changes in the IR radiation signal of a wetted soldered connection during the solder reflow process, resulting from rapid changes in emissivity of the materials. This is accomplished through the use of an IR camera connected to a computer, and a substrate heater controlled by the computer to achieve a predetermined temperature profile at the component leads.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTELLECTUAL VENTURES HOLDING 40 LLCTAIPEI11

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Flake, Robert H Austin, TX 9 60

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 5574801 Method of inspecting an array of solder ball connections of an integrated circuit module 109 1994
 
TELEDYNE LICENSING, LLC (1)
5262022 Method of assessing solderability 7 1991
 
BULL S.A. (1)
* 5208528 Method for inspecting a populated printed circuit board, particularly for inspecting solder joints on the board and a system for working this method 16 1992
 
KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) (1)
* 5836504 Method and apparatus for soldering inspection of a surface mounted circuit board 8 1997
 
Semi-Pac (1)
* 5988487 Captured-cell solder printing and reflow methods 17 1997
 
VLSI TECHNOLOGY, INC. (1)
* 5407275 Non-destructive test for inner lead bond of a tab device 5 1992
 
FREESCALE SEMICONDUCTOR, INC. (1)
* 5246291 Bond inspection technique for a semiconductor chip 30 1992
 
Denyo Kabushiki Kaisha (1)
* 5250809 Method and device for checking joint of electronic component 32 1992
 
ALUMINUM COMPANY OF AMERICA (1)
* 4657196 Mechanism for supporting and rotating a coil 5 1985
 
TELEDYNE SCIENTIFIC & IMAGING, LLC (2)
5425859 Method and apparatus for assessing and restoring solderability 3 1993
5401380 Apparatus for assessing solderability 1 1993
 
MCMASTER UNIVERSITY (1)
* 4941256 Automatic visual measurement of surface mount device placement 13 1989
 
PETRY, HARALD (1)
* 5118945 Photothermal test process, apparatus for performing the process and heat microscope 23 1990
 
The United States of America as represented by the Secretary of the Navy (1)
* 5446549 Method and apparatus for noncontact surface contour measurement 40 1993
 
COGNEX CORPORATION (2)
* 5676302 Method and apparatus for crescent boundary thresholding on wire-bonded leads 36 1995
* 5912984 Method and apparatus for in-line solder paste inspection 68 1996
 
The United States of America as represented by the Secretary of the Army (1)
5357346 Solderability tester methodology 3 1992
 
VANZETTI SYSTEMS, INC. (2)
* 4657169 Non-contact detection of liquefaction in meltable materials 17 1984
* 4696104 Method and apparatus for placing and electrically connecting components on a printed circuit board 24 1986
 
GEORGIA TECH RESEARCH CORPORATION (1)
* 5963662 Inspection system and method for bond detection and validation of surface mount devices 92 1996
 
RCA Corporation (2)
4409333 Method for the evaluation of solderability 7 1981
4467638 Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system 9 1983
 
Amdata, Inc. (1)
* 5089700 Apparatus for infrared imaging inspections 6 1990
 
RAYTHEON COMPANY (1)
* 4792683 Thermal technique for simultaneous testing of circuit board solder joints 46 1987
 
TYCO ELECTRONICS CORPORATION (1)
* 5971249 Method and apparatus for controlling a time/temperature profile inside of a reflow oven 18 1997
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 5148375 Soldering appearance inspection apparatus 21 1990
5206705 Method of checking external shape of solder portion 8 1990
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 6840671 System and method for non-contact temperature sensing 1 2002
 
Art Recherches et Technologies Avancees Inc./Art Advanced Research Technologies, Inc. (1)
* 2002/0027,941 Method and apparatus for detection of defects using localized heat injection of narrow laser pulses 8 2001
 
TAMIRAS PER PTE. LTD., LLC (7)
7485951 Modularized die stacking system and method 2 2003
* 2004/0000,707 Modularized die stacking system and method 14 2003
7542304 Memory expansion and integrated circuit stacking system and method 1 2004
7371609 Stacked module systems and methods 3 2004
7310458 Stacked module systems and methods 8 2005
7656678 Stacked module systems 1 2005
* 2006/0092,614 Stacked module systems and methods 2 2005
 
HON HAI PRECISION INDUSTRY CO., LTD. (2)
* 8269133 Electric soldering iron with automatic poweroff and method thereof 0 2009
* 2011/0024,395 ELECTRIC SOLDERING IRON WITH AUTOMATIC POWEROFF AND METHOD THEREOF 0 2009
 
BLACKBERRY LIMITED (4)
* 8528804 Method and apparatus for testing solderability of electrical components 0 2006
* 2007/0235,504 Method and apparatus for testing solderability of electrical components 0 2006
7874470 Method and apparatus for testing solderability of electrical components 0 2010
* 2010/0320,256 METHOD AND APPARATUS FOR TESTING SOLDERABILITY OF ELECTRICAL COMPONENTS 0 2010
 
PHOTON DYNAMICS, INC. (2)
* 6840667 Method and apparatus for detection of defects using thermal stimulation 25 2003
* 2004/0028,113 Method and apparatus for detection of defects using thermal stimulation 5 2003
 
TAMIRAS PER PTE. LTD., LLC (15)
7586758 Integrated circuit stacking system 2 2004
7335975 Integrated circuit stacking system and method 2 2004
* 2005/0041,403 Integrated circuit stacking system and method 5 2004
7595550 Flex-based circuit module 23 2005
7495334 Stacking system and method 3 2005
* 2005/0280,135 Stacking system and method 5 2005
7524703 Integrated circuit stacking system and method 4 2005
7323364 Stacked module systems and method 1 2006
* 2006/0263,938 Stacked module systems and method 0 2006
7417310 Circuit module having force resistant construction 6 2006
7572671 Stacked module systems and methods 0 2007
7719098 Stacked modules and method 7 2007
* 2008/0088,003 Stacked Modules and Method 1 2007
7804985 Circuit module having force resistant construction 2 2008
7626273 Low profile stacking system and method 0 2009
 
STAKTEK GROUP L.P. (5)
* 2004/0195,666 Stacked module systems and methods 1 2004
* 2006/0043,558 Stacked integrated circuit cascade signaling system and method 0 2004
* 2006/0255,446 Stacked modules and method 6 2006
* 2007/0117,262 Low Profile Stacking System and Method 0 2007
* 2008/0090,329 Stacked Modules and Method 3 2007
* Cited By Examiner