US Patent No: 6,360,935

Number of patents in Portfolio can not be more than 2000

Apparatus and method for assessing solderability

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Abstract

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The invention is an apparatus and method for assessing the solderability of electronic component leads and adjacent mounting surfaces. The apparatus and method enables assessment of solderability of fine pitch surface mount components that may be 'leadless' or have such small leads that other methods are unable to make measurements required for assessing solderability. The invention also provides a reliable automated test technology for electronic component solderability. It is based on the use of measurements of the distinctive changes in the IR radiation signal of a wetted soldered connection during the solder reflow process, resulting from rapid changes in emissivity of the materials. This is accomplished through the use of an IR camera connected to a computer, and a substrate heater controlled by the computer to achieve a predetermined temperature profile at the component leads.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTELLECTUAL VENTURES HOLDING 40 LLCTAIPEI23

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Flake, Robert H Austin, TX 10 48

Cited Art Landscape

Patent Info (Count) # Cites Year
 
COGNEX CORPORATION (2)
5,676,302 Method and apparatus for crescent boundary thresholding on wire-bonded leads 32 1995
5,912,984 Method and apparatus for in-line solder paste inspection 65 1996
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
5,148,375 Soldering appearance inspection apparatus 21 1990
5,206,705 Method of checking external shape of solder portion 8 1990
 
RCA Corporation (2)
4,409,333 Method for the evaluation of solderability 6 1981
4,467,638 Method and apparatus for quantitatively evaluating the soldering properties of a wave soldering system 8 1983
 
TELEDYNE SCIENTIFIC & IMAGING, LLC (2)
5,425,859 Method and apparatus for assessing and restoring solderability 2 1993
5,401,380 Apparatus for assessing solderability 1 1993
 
Vanzetti Systems, Inc. (2)
4,657,169 Non-contact detection of liquefaction in meltable materials 16 1984
4,696,104 Method and apparatus for placing and electrically connecting components on a printed circuit board 24 1986
 
ALUMINUM COMPANY OF AMERICA (1)
4,657,196 Mechanism for supporting and rotating a coil 5 1985
 
Amdata, Inc. (1)
5,089,700 Apparatus for infrared imaging inspections 5 1990
 
BULL S.A. (1)
5,208,528 Method for inspecting a populated printed circuit board, particularly for inspecting solder joints on the board and a system for working this method 15 1992
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,246,291 Bond inspection technique for a semiconductor chip 30 1992
 
GEORGIA TECH RESEARCH CORPORATION (1)
5,963,662 Inspection system and method for bond detection and validation of surface mount devices 87 1996
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
5,574,801 Method of inspecting an array of solder ball connections of an integrated circuit module 107 1994
 
KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) (1)
5,836,504 Method and apparatus for soldering inspection of a surface mounted circuit board 6 1997
 
MCMASTER UNIVERSITY (1)
4,941,256 Automatic visual measurement of surface mount device placement 13 1989
 
NAKATA, SHUJI (1)
5,250,809 Method and device for checking joint of electronic component 31 1992
 
PETRY, HARALD (1)
5,118,945 Photothermal test process, apparatus for performing the process and heat microscope 21 1990
 
RAYTHEON COMPANY (1)
4,792,683 Thermal technique for simultaneous testing of circuit board solder joints 46 1987
 
Semi-Pac (1)
5,988,487 Captured-cell solder printing and reflow methods 16 1997
 
TELEDYNE LICENSING, LLC (1)
5,262,022 Method of assessing solderability 6 1991
 
The United States of America as represented by the Secretary of the Army (1)
5,357,346 Solderability tester methodology 3 1992
 
The United States of America as represented by the Secretary of the Navy (1)
5,446,549 Method and apparatus for noncontact surface contour measurement 35 1993
 
TYCO ELECTRONICS CORPORATION (1)
5,971,249 Method and apparatus for controlling a time/temperature profile inside of a reflow oven 17 1997
 
VLSI TECHNOLOGY, INC. (1)
5,407,275 Non-destructive test for inner lead bond of a tab device 5 1992
 
Other [Check patent profile for assignment information] (1)
4,227,415 Method and apparatus for testing solderability and de-soldering wicks 4 1979

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
OVID DATA CO. LLC (14)
7,485,951 Modularized die stacking system and method 2 2003
7,542,304 Memory expansion and integrated circuit stacking system and method 1 2004
7,371,609 Stacked module systems and methods 3 2004
7,586,758 Integrated circuit stacking system 2 2004
7,335,975 Integrated circuit stacking system and method 2 2004
7,595,550 Flex-based circuit module 6 2005
7,495,334 Stacking system and method 3 2005
7,524,703 Integrated circuit stacking system and method 3 2005
7,310,458 Stacked module systems and methods 5 2005
7,656,678 Stacked module systems 0 2005
7,323,364 Stacked module systems and method 0 2006
7,417,310 Circuit module having force resistant construction 3 2006
7,572,671 Stacked module systems and methods 0 2007
7,804,985 Circuit module having force resistant construction 0 2008
 
STAKTEK GROUP L.P. (2)
7,719,098 Stacked modules and method 5 2007
7,626,273 Low profile stacking system and method 0 2009
 
BLACKBERRY LIMITED (1)
8,528,804 Method and apparatus for testing solderability of electrical components 0 2006
 
HON HAI PRECISION INDUSTRY CO., LTD. (1)
8,269,133 Electric soldering iron with automatic poweroff and method thereof 0 2009
 
PHOTON DYNAMICS, INC. (1)
6,840,667 Method and apparatus for detection of defects using thermal stimulation 20 2003
 
RESEARCH IN MOTION LIMITED (1)
7,874,470 Method and apparatus for testing solderability of electrical components 0 2010
 
Other [Check patent profile for assignment information] (1)
6,840,671 System and method for non-contact temperature sensing 0 2002