Sputtering installation with two longitudinally placed magnetrons
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United States of America Patent
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Mar 26, 2002
Grant Date -
N/A
app pub date -
Mar 26, 1999
filing date -
Apr 29, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A sputtering installation has two longitudinally extended magnetrons disposed next to one another and each has a target on an upper side thereof. Increasing utilization of the targets in the sputtering installation is accomplished by homogenizing the discharge resistance of the magnetrons along the directrix such that a partial discharge resistance of a target point on the directrix has the same magnitude as the partial discharge resistance of a different target point on the directrix.
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