Semiconductor device and method for fabricating it, and semiconductor sealing resin composition
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United States of America Patent
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Mar 26, 2002
Grant Date -
N/A
app pub date -
Sep 23, 1999
filing date -
Feb 9, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A sealed semiconductor chip having a surface film of a sealed resin composition, wherein the resin composition has a linear expansion coefficient of 60.times.10.sup.-6 /K or less at a temperature equal to or less than its glass transition point and 140.times.10.sup.-6 /K or less at a temperature equal to or higher than its glass transition point; a semiconductor-sealing resin composition for sealing a semiconductor chip, which has a linear expansion coefficient of 60.times.10.sup.-6 /K or less at a temperature equal to or less than its glass transition point and 140.times.10.sup.-6 /K or less at a temperature equal to or higher than its glass transition point; the sealed semiconductor chip is chip size and has high reliability; the semiconductor-sealing resin composition creates a good seal on chip wafers and has high reliability; and the chip wafers sealed with a surface film of the resin composition warp little.
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