CVD/PVD/CVD/PVD fill process
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United States of America Patent
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Mar 26, 2002
Grant Date -
N/A
app pub date -
Dec 22, 1999
filing date -
Dec 22, 1999
priority date (Note) -
Expired
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Abstract
A method is provided in which intermediate sized structures can be filled without forming voids during the fill process. The methods involve use of a sequence of CVD/PVD/CVD/PVD steps. The methods are especially effective for filling 'intermediate' size features in damascene and dual damascene structures.
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