Method for fabricating a microelectronic fabrication having formed therein a redistribution structure
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 26, 2002
Grant Date -
N/A
app pub date -
May 5, 2000
filing date -
May 5, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Within a method for fabricating a microelectronic fabrication there is first provided a substrate. There is then formed over the substrate a patterned bond pad layer. There is also formed over the substrate and in electrical communication with the patterned bond pad layer a patterned redistribution layer, wherein the patterned redistribution layer is formed employing a plating method. The method is particularly economical for fabricating the microelectronic fabrication.
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