Semiconductor device

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United States of America Patent

PATENT NO 6362523
SERIAL NO

09475657

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In a semiconductor device, a semiconductor circuit is located on one surface (front surface) of a semiconductor chip and circuit elements, such as capacitors, resistors, or coils and pads connected to these circuit elements are located on the other surface (rear surface) of the semiconductor chip. The circuit elements are formed on the rear surface by chemical vapor deposition, sputtering, or electrolytic plating.

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Patent Owner(s)

  • MITSUBISHI DENKI KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuda, Kazuyoshi Tokyo, JP 9 82

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