Contactless interconnection system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Mar 26, 2002
Grant Date -
N/A
app pub date -
Apr 13, 2000
filing date -
Apr 13, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A contactless interconnecting system is provided between a computer chip package and a circuit board. The system includes a computer chip package having a silicon wafer mounted on a support structure which includes a wall with a substantially planar upper surface. The wall is fabricated of a dielectric material. A pattern of discrete terminal lands are disposed on the upper surface of the wall and are electrically coupled to the silicon wafer. A circuit board is juxtaposed below the wall of the chip package and includes a substantially planar upper surface having a pattern of discrete circuit pads aligned with the terminal lands.
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