Spring contact for providing high current power to an integrated circuit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 2, 2002
Grant Date -
N/A
app pub date -
Jul 12, 2000
filing date -
Jul 12, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit package includes a semiconductor die, a base, and a plurality of external contacts. The base is coupled to the semiconductor die and includes at least one contact pad coupled to the semiconductor die. The plurality of external contacts extend from the base and are coupled to the semiconductor die. A circuit assembly includes a printed circuit board, an integrated circuit package, and a socket. The integrated circuit package includes a semiconductor die, a base coupled to the semiconductor die, and a plurality of external contacts extending from the base and being coupled to the semiconductor die. The base includes at least one contact pad coupled to the semiconductor die. The socket is coupled to the printed circuit board and adapted to receive the base. A contact is adapted to interface with the contact pad and one of the printed circuit board and the socket.
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