Semiconductor device and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 2, 2002
Grant Date -
N/A
app pub date -
Apr 25, 2000
filing date -
Apr 27, 1999
priority date (Note) -
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Abstract
A semiconductor device having an overcurrent protection element therein is provided. The device comprises: a substrate having first and second main surfaces; a semiconductor chip fixed to the first main surface of the substrate; a fuse element fixed to the first main surface of the substrate; a cover member fixed to the substrate for sealing the semiconductor chip and the fuse element in an airtight space; and external connecting terminals formed on the second main surface of the substrate.
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