Method of manufacturing a semiconductor device having data pads formed in scribed area
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United States of America Patent
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-
Apr 2, 2002
Grant Date -
N/A
app pub date -
Mar 30, 2000
filing date -
Aug 26, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
On a semiconductor wafer, there are formed chip areas for storing memory areas, scribe areas for cutting the semiconductor wafer, pads for supplying electric signals from the outside in order to write data into the memory areas, and lead wires for electrically connecting the pads with the memory areas. The pads are formed within the scribe areas. After data has been written into the memory areas through the pads, the semiconductor wafer is cut along the scribe areas, thereby obtaining semiconductor chips. At the time of this cutting, the pads or the lead wires are cut.
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