Holding unit for semiconductor wafer sawing
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United States of America Patent
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-
Apr 9, 2002
Grant Date -
N/A
app pub date -
Jun 18, 1999
filing date -
Jun 18, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from substantially the same material as an ingot resting thereon. The holding unit includes a top surface for receiving an ingot, a bottom surface, a pair of side walls, and a cavity formed in the holding unit. The cavity forms a plurality of break points in the holding unit. When contacted by the blade, the holding unit fractures at the break points to minimize the chipping of the wafer.
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