Method for manufactoring and using stencil/screen
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 9, 2002
Issued Date -
N/A
app pub date -
Feb 28, 2000
filing date -
Sep 23, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for improved stencil/screen print quality is disclosed. The stencil or screen assists in application of a printable material onto a substrate, such as an adhesive to a semiconductor die of a semiconductor wafer during a lead-on-chip (LOC) packaging process. In one embodiment, the stencil includes a coating applied to at least one surface of a pattern of the stencil or screen to retard running of the printable material onto the surface. In another embodiment, the stencil or screen includes a second coating applied to at least one other surface of the pattern to promote spreading of the printable material onto the substrate.
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