Solder balls and columns with stratified underfills on substrate for flip chip joining
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United States of America Patent
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Apr 9, 2002
Issued Date -
N/A
app pub date -
Jan 12, 1999
filing date -
Jan 13, 1998
priority date (Note) -
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Abstract
The present invention discloses an improved method for carry out a flip chip packaging process for attaching a semiconductor integrated circuit (IC) wafer having a plurality of input/output terminals, to a substrate. The method includes the steps of: 1) securely placing a plurality of solder balls on the substrate with each of said solder balls corresponding to a location of one of the input/output terminals on the integrated circuit wafer; 2) flipping the integrated circuit wafer for aligning each of the input/output terminals of the IC wafer to one of the solder balls; and 3) mounting the IC wafer onto the substrate for placing the I/O terminals on a corresponding solder ball and applying a reflow temperature for soldering the IC wafer to the substrate.
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