Film forming method and film forming apparatus
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United States of America Patent
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Apr 16, 2002
Grant Date -
N/A
app pub date -
Apr 6, 2000
filing date -
Apr 8, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A resist solution discharge nozzle for discharging a resist solution to a wafer is moved at a constant speed along a radial direction of the wafer while the wafer is being rotated. During this movement, the amount of the resist solution to be discharged from the resist solution discharge nozzle is gradually decreased. The resist solution discharged to the wafer is applied to the front surface of the wafer drawing a spiral track, and coating amounts of the resist solution per unit area with respect to a central portion and a peripheral portion of the wafer can be made equal. Accordingly, waste of a processing solution supplied onto a substrate can be eliminated, and a uniform processing solution film can be formed on the substrate.
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