High density interconnect system and method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 16, 2002
Grant Date -
N/A
app pub date -
Mar 23, 2001
filing date -
Mar 23, 2000
priority date (Note) -
Expired
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Importance
Abstract
An electrical interconnect system allows high signal density with means of electrical isolation to minimize degradation of electrical signals. The electrical interconnect system includes signal conductors which are surrounded by multiple reference or ground conductors, a given signal conductor for example surrounded by four reference conductors. The interconnect system includes a reference element with two sets of reference conductors, one of the sets offset a distance from the other set.
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