Method of manufacturing semiconductor components
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United States of America Patent
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Apr 16, 2002
Grant Date -
N/A
app pub date -
Apr 6, 1998
filing date -
Apr 6, 1998
priority date (Note) -
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Abstract
A method of manufacturing semiconductor components (200, 400, 700) includes assembling, packaging, and testing the semiconductor components (200, 400, 700) while the semiconductor components (200, 400, 700) are mounted on an adhesive layer (220). The method of can also keep the semiconductor components (200, 400, 700) mounted on the adhesive layer (220) between each of the assembling, packaging, and testing steps.
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