Methods of making semiconductor chip assemblies
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United States of America Patent
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Apr 16, 2002
Grant Date -
N/A
app pub date -
Sep 8, 1999
filing date -
Sep 24, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of making semiconductor chip assemblies includes providing a semiconductor wafer including a plurality of semiconductor chips having contacts on a contact bearing surface thereof and providing a substrate having a first surface with a plurality of conductive terminals located thereon and a second surface. The substrate is then assembled with the wafer so that the terminals are electrically connected to the contacts on the chips and portions of the substrate are removed to expose the terminals. In certain embodiments, an encapsulant may be injected between the wafer and the substrate for providing a compliant layer.
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