Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board
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United States of America Patent
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-
Apr 16, 2002
Issued Date -
N/A
app pub date -
Mar 11, 1998
filing date -
Feb 23, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In BGA (Ball Grid Array), LGA (Land Grid Array) and the like, a resin layer is formed between an external connecting electrode of a chip carrier and a circuit wiring board. Consequently, the external connecting electrode can be prevented from cracking due to a difference between the coefficients of thermal expansion of the external connecting electrode and the circuit wiring board. Thus, the reliability in a thermal shock test can be enhanced. A connecting wiring which is conducted to an electrode of a semiconductor device is provided on a surface of an electrical insulating board, and the external connecting electrode for connection to a connecting electrode of the circuit wiring board is provided on a back face of the electrical insulating board. The external connecting electrode has a solder ball made of a conductor, and the resin layer formed on the side portion thereof.
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