Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 16, 2002
Grant Date -
Feb 14, 2002
app pub date -
Jun 4, 1999
filing date -
Jun 4, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device has (a) a semiconductor component; (b) a circuit substrate; (c) a base material which is placed between the semiconductor component and the circuit substrate; and (d) a conductive paste, which is filled into a hole formed in the base material, for electrically connecting between a terminal electrode of the semiconductor component and an internal connection electrode of the circuit substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully