Method of forming self-aligned via structure
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United States of America Patent
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Apr 16, 2002
Issued Date -
N/A
app pub date -
Nov 4, 1996
filing date -
Feb 24, 1994
priority date (Note) -
Expired
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Abstract
A self-aligned via between interconnect layers in an integrated circuit, and a process for forming such a via which allows a less precise masking alignment to be used to fabricate an integrated circuit with increased packing density.
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