Electrical or electronic component encapsulated in a sealed manner
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 16, 2002
Grant Date -
N/A
app pub date -
Mar 30, 2000
filing date -
Mar 31, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This electrical or electronic component with sealed encapsulation comprises: a support (1) intended to house one or more electrical or electronic components (5) from which electrically conducting tracks (6) radiate towards the periphery of the said support; and a protective and sealing casing (2) attached to the said support and hermetically sealed with respect to the latter by means of a peripheral metal bead (7), the main part of the casing, intended to be placed opposite the said support (1), being provided with hollow conducting elements (3) which pass right through the thickness of the said casing, and from the external upper end of which elements (3) electrically conducting metal tracks (9) radiate towards the periphery of the casing, the internal lower end of which elements (3) being connected to at least one electrical connection track (6) provided on the said support via a metal hybridization ball (8).
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