Bondable compliant pads for packaging of a semiconductor chip and method therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 16, 2002
Issued Date -
N/A
app pub date -
Aug 16, 1999
filing date -
Jun 10, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic package comprising a microelectronic element, resilient element including one or more intermediary layers capable of being wetted and assembled with the microelectronic element, and an adhesive is provided. The adhesive contacts at least one of the one or more intermediary layers and the microelectronic element. A resilient element is also provided.
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