Ball grid array-integrated circuit testing device
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United States of America Patent
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-
Apr 16, 2002
Grant Date -
N/A
app pub date -
Apr 30, 1998
filing date -
May 30, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A measuring mechanism for a BGA-IC capable of facilitating and assuring the contact between a soldering ball of a BGA-IC and a BGA contact seat even if a foreign matter is sandwiched therebetween, and also capable of saving time involved in recontact therebetween, and of shortening measuring time. The measuring mechanism for a BGA-IC comprising a substrate including a BGA contact seat which is embedded therein and has a conical contact surface, wherein the BGA contact seat is connected to a tester, and the BGA-IC has the soldering ball and wherein the soldering ball contacts the conical contact surface of the BGA contact seat when the BGA-IC is tested.
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