Plasma enhanced chemical processing reactor and method

United States of America Patent

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Apr 23, 2002
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app pub date
May 18, 2000
filing date
Jul 10, 1995

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Expired

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Abstract

An apparatus for processing a substrate comprising a processing chamber and a substrate support system comprising an electrostatic chuck having a body portion and a substrate support surface and one or more arms extending from the body portion to mount the electrostatic chuck to a side wall portion of the processing chamber is provided.

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Patent Owner	Address
APPLIED MATERIALS INC	3050 BOWERS AVENUE SANTA CLARA CA 95054

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C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....

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Inventor Name	Address	# of filed Patents	Total Citations
Durbin, William J	Capitola, CA	5	2304
Fenske, Dennis C	Felton, CA	5	2304
Matthiesen, Richard H	San Jose, CA	8	2840
Ross, Eric D	Santa Cruz, CA	7	2392
van, Os Ron	Sunnyvale, CA	27	1751

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Plasma enhanced chemical processing reactor and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

09575217

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PATENT NO	6375750
SERIAL NO	09575217
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09575217

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