Microencapsulated adhesive
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United States of America Patent
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Apr 23, 2002
Grant Date -
N/A
app pub date -
Nov 17, 1992
filing date -
Nov 17, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microencapsulated adhesive and a method for producing that microencapsulated adhesive is disclosed. The adhesive is produced from an alkyl acrylate or methacrylate monomer having about 4 to about 12 carbon atoms, or a mixture thereof. The monomer is encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/formaldehyde encapsulation. The microcapsules may be polyamide or polyurea. The monomer is polymerized in the microcapsules by heating to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.
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