Resin/copper/metal laminate and method of producing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 23, 2002
Grant Date -
N/A
app pub date -
Sep 21, 1999
filing date -
Aug 11, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming a laminate for use in the production of printed circuit boards, comprising the steps of: a) forming a component comprised of a sheet of copper foil and a sheet of metal, the sheet of copper foil having an essentially uncontaminated surface facing an essentially uncontaminated surface of the sheet of metal, the surfaces of the sheets being in unattached contact with each other in an area that defines a substantially uncontaminated zone; b) applying a preformed adhesive film formed of a substantially uncured polymeric material onto an exposed surface of the copper foil, the adhesive film having a first surface and a second surface, the film being attached to the component with the first surface in contact with an exposed surface of the copper foil; and c) curing the adhesive film, wherein the second surface of the adhesive film is at least partially uncured.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully