Importance

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Abstract

A system and method is provided that facilitates the application of a uniform layer of photoresist material spincoated onto a semiconductor substrate (e.g wafer). The present invention accomplishes this end by utilizing a measurement system that measures the thickness uniformity of the photoresist material applied on a test wafer by a nozzle, and then adjusting the viscosity of the photoresist material by varying the ratio in a solvent/resist mixture, and/or adjusting the temperature of the mixture. A system and method that employs a plurality of nozzles is also provided that disperses resist at different annular regions on a wafer to facilitate the application of a uniform layer of photoresist material spincoated onto the wafer. The system and method utilize a measurement system that measures the thickness and thickness uniformity of each layer of photoresist material applied at each annular region of the wafer. The measured thickness uniformity and overall thickness for each annular region is then used to adjust the volume and viscosity of a solvent/resist mixture applied through each nozzle.

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First Claim