Multilayer printed wiring board and its production process, resin composition for filling through-hole
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United States of America Patent
Stats
-
Apr 23, 2002
Grant Date -
N/A
app pub date -
Apr 21, 2000
filing date -
Oct 14, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.
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Cited Art Landscape
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