Laser cutting of semiconductor materials
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United States of America Patent
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Apr 23, 2002
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N/A
app pub date -
Jul 26, 2000
filing date -
Jul 26, 2000
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Abstract
A method of cutting thin bodies of silicon so as to minimize edge damage comprises traversing said bodies with the beam of a pulsed laser in a vacuum or in the presence of forming gas or a noble gas.
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