Thermally conductive chuck with thermally separated sealing structures
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United States of America Patent
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Apr 30, 2002
Issued Date -
N/A
app pub date -
Sep 21, 2000
filing date -
Sep 26, 1997
priority date (Note) -
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Abstract
A chuck having two distinct portions mounts a substrate within a vacuum processing chamber. A first sealing stage confines a gas within a heat-transfer interface between one portion of the chuck and the substrate. A second sealing stage collects gas escaping from the heat-transfer interface within an intermediate space bounded by the two portions of the chuck and the substrate. Pressure in the intermediate space is reduced with respect to pressure at the heat-transfer interface to inhibit leakage of gas from the heat-transfer interface into the vacuum processing chamber.
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