Component of printed circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 30, 2002
Grant Date -
N/A
app pub date -
May 5, 2000
filing date -
May 5, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming a laminate used in the manufacture of printed circuit boards, comprising the steps of applying a layer of chromium having a thickness from about 30 grams per square meter to about 160 grams per square meter to each side of a steel substrate having a thickness from about 0.10 mm to about 0.20 mm. Applying a layer of copper having a thickness from about 2 .mu.m to about 70 .mu.m to each of the chromium layers. Positioning the steel substrate between two dielectric layers with adhesive disposed between the copper layers and the dielectric layers. Applying heat and pressure to the layers to bond the copper layers to the dielectric layers. Separating the steel substrate from the copper layers, and discarding the steel substrate.
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