Importance

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Abstract

A method of placing solder balls on a connection component includes providing a dielectric element having first conductive elements on a first surface, second conductive elements on a second surface, and conductive vias electrically interconnecting one or more of the first conductive elements and one or more of the second conductive elements. The first conductive elements may include conductive pads overlying the first surface of the dielectric element and the second conductive elements may include conductive leads or traces overlying the second surface of the dielectric element. Each via may have an opening at the first surface of the dielectric element. One or more of the vias may also have a closed end adjacent the second surface of the dielectric element. The via openings preferably extend through the first conductive elements. The method also includes positioning solder balls atop one or more of the first conductive elements, and then reflowing the solder balls for permanently attaching the solder balls to the conductive pads, wherein at least a portion of the via openings are exposed at the commencement of the reflowing step. Before reflowing the solder balls, the solder balls may be secured over the first conductive elements using a flux material. Maintaining at least a portion of each via opening exposed at the commencement of the reflowing step allows any air and/or flux solvent present in the via(s) to escape before the via opening(s) are completely closed by the reflowed solder material.

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First Claim