Heat bonding apparatus for manufacturing an ink-jet printhead
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United States of America Patent
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May 7, 2002
Grant Date -
N/A
app pub date -
Jan 24, 2000
filing date -
Sep 8, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat bonding apparatus for manufacturing an ink-jet printhead, whereby a flexible circuit tape is heat-bonded on the an IC chip of an ink-jet printhead so that a signal from the printing apparatus can be transmitted to the IC chip of the ink-jet printhead to control the ink-jet printing operation. The heat bonding apparatus comprises a head seat; a heat bonding head seated in the head seat, the heat bonding head being movable along with the head seat to carry out a heat bonding process; and a heat bonding sheet of arc shape and in the form of an elastic metal sheet. The heat bonding sheet is deformable under pressure and one end of the heat bonding sheet is secured to the heat bonding head so that when the heat bonding sheet is pressed for heat bonding the flexible circuit tape and the IC chip, the heat bonding sheet undergoes deformation and in the mean time pushes the air away from between the flexible circuit tape and the IC chip to let them fully contact each other.
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