Printed circuit board assembly having adhesive joint
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United States of America Patent
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-
May 7, 2002
Issued Date -
N/A
app pub date -
Mar 12, 2001
filing date -
Apr 30, 1998
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A new process for electrically and mechanically joining arrays of conductors on flexible printed circuits and other flexible conductors including collated flat, flexible cables (FFCs). An array of flat copper conductors on a flexible dielectric sheet is electroplated with tin-lead solder. Surface insulation is locally omitted or removed from conductor surfaces. A second circuit or cable is overlapped in competent electrical communication and the solder plating fused by inductively heating the copper to join the two conductor arrays. An adhesive placed between conductors is also thermally activated to bond the film on the two cable arrays together. This insulates the electrical connections and seals them from attack by moisture and chemical pollutants.
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