Multi-layer circuit board
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United States of America Patent
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May 7, 2002
Grant Date -
N/A
app pub date -
Mar 6, 2001
filing date -
Mar 6, 2001
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A multi-layer circuit board includes first, second, third, fourth and fifth insulating substrates, first, second, third and fourth signal wiring layers, a ground wiring layer, and a power wiring layer. The insulating substrates and the wiring layers are press-bonded to each other to form the circuit board with a thickness of about 1.2 mm. Each of the first and fifth insulating substrates has a thickness ranging from 4.175 to 4.725 mil. Each of the second and fourth insulating substrates has a thickness ranging from 5.7 to 6.3 mil. The third insulating substrate has a thickness ranging to 16.8 mil.
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