Leadless image sensor package structure and method for making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 7, 2002
Grant Date -
N/A
app pub date -
Mar 24, 2000
filing date -
Mar 24, 2000
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A leadless image sensor package constructed on a lead frame includes a die pad and a plurality of leads disposed at the periphery of the die pad. A molding compound, disposed on the top surface of the lead frame and being surrounding the die pad on the periphery of the lead frame, fills the clearance between the die pad and the leads and exposes, on the top surface, the die pad and the wire-bonding portion of the leads. Moreover, the lead frame and the molding compound constitute a 'chip containing space' with chip set therein. Further, the chip with its back surface attached to the top surface of the die pad makes use of the wires to electrically connect to the bonding pad and the top surface of the wire-bonding portion, thereafter, a transparent lid is used to cap and seal the 'chip containing space'.
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