Fingered capacitor in an integrated circuit
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United States of America Patent
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May 7, 2002
Grant Date -
N/A
app pub date -
Sep 29, 2000
filing date -
Sep 29, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A fingered capacitor in an integrated circuit. A first capacitor element is formed in a first layer of an integrated circuit (IC) die. The first capacitor element includes a positive plate and a negative plate. Each of the positive and negative plates of the first capacitor element has a plurality of fingers interdigitated with the fingers of the other of the positive and negative plates of the first capacitor element. The fingers are separated by a dielectric. The interdigitated fingers cooperate to generate fringe capacitance between neighboring fingers. A plurality of capacitor elements having interdigitated fingers can be provided in adjacent layers of the IC die.
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