Process for preparing ferroelectric thin films
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 14, 2002
Issued Date -
N/A
app pub date -
Dec 3, 1999
filing date -
Jun 26, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a film structure comprising a ferroelectric thin film formed on a substrate, the ferroelectric thin film contains a rare earth element (Rn), Pb, Ti, and O in an atomic ratio in the range: 0.8.ltoreq.(Pb+Rn)/Ti.ltoreq.1.3 and 0.5.ltoreq.Pb/(Pb+Rn).ltoreq.0.99, has a perovskite type crystal structure, and is of (001) unidirectional orientation or a mixture of (001) orientation and (100) orientation. The ferroelectric thin film can be formed on a silicon (100) substrate, typically by evaporating lead oxide and TiOx in a vacuum chamber while introducing an oxidizing gas therein.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully