Method of molding a molding resin on a substrate having openings, switch substrate with a molding resin, method of forming a switch pattern on a switch substrate, and a switch substrate
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United States of America Patent
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-
May 14, 2002
Grant Date -
N/A
app pub date -
Dec 23, 1999
filing date -
Dec 24, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A substrate (10), a first mold (200) and a second mold (250) are prepared, and a plurality of switch patterns (14), (18) are provided by providing openings (pattern-removal portions) (A) in such a manner that a pattern (11), which has been formed on the surface of the substrate (10), is divided into a plurality of patterns to form A switch substrate. Next, the switch substrate (1) is clamped between the first mold (200) and the second mold (250). At such time, the side of the switch substrate (1) provided with the switch patterns (14), (18) is brought into surface contact with an abutting surface (201) of the first mold (200) and, at the same time, a cavity (253) provided in the second mold (250) opposes the other side of the switch substrate. Next, a molten molding resin is charged into the cavity (253) provided in the second mold (250) to thereby fill the cavity (253) and the openings (A) of the substrate with the molding resin. After the molding resin hardens, the first mold (200) and the second mold (250) are separated and the switch substrate (1), which will have the molding resin case 40 attached thereto, is extracted.
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