Compliant semiconductor chip package with fan-out leads and method of making same
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United States of America Patent
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May 14, 2002
Grant Date -
Jan 17, 2002
app pub date -
Sep 10, 2001
filing date -
Feb 5, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor chip package, and a method of making such a package, including a flexible dielectric element with a plurality of electrically conductive terminals, an expander ring connected to the flexible dielectric element, a semiconductor chip disposed with a central opening in the expander ring, and fan-in and fan-out leads connecting the terminals to contacts on the semiconductor chip. The package also has an elastomer encapsulant disposed in the gap between the expander ring and the semiconductor chip. The size of the gap is controlled to minimize the pressure exerted on the leads by the elastomer as it expands and contracts in response to changes in temperature. The semiconductor chip and expander ring may also be connected to a heat sink or thermal spreader with a compliant adhesive.
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